KJ0600_881587301#&LOCATION MARKING DEVICE FOR SEMICONDUCTOR WAFERS FOR THE ELECTRONICS INDUSTRY B94C94XYZ UNIT MODEL: B94 MANUFACTURED IN 2021 100% NEW_KJ#0600#&EN
KJ0600_881587301#&LOCATION MARKING DEVICE FOR SEMICONDUCTOR WAFERS FOR THE ELECTRONICS INDUSTRY B94C94XYZ UNIT MODEL: B94 MANUFACTURED IN 2021 100% NEW_KJ#0600#&EN
KJ0600_881587301#&LOCATION MARKING DEVICE FOR SEMICONDUCTOR WAFERS FOR THE ELECTRONICS INDUSTRY B94C94XYZ UNIT MODEL: B94 MANUFACTURED IN 2021 100% NEW_KJ#0600#&EN
KJ0600_881587301#&LOCATION MARKING DEVICE FOR SEMICONDUCTOR WAFERS FOR THE ELECTRONICS INDUSTRY B94C94XYZ UNIT MODEL: B94 MANUFACTURED IN 2021 100% NEW_KJ#0600#&EN
30-July-2021
8486901900
TJ0427_880753351 # & ROBOTS SERVING THE ELECTRICAL INDUSTRY TU_T0081 (PARTS OF MACHINES PRODUCING SEMICONDUCTOR WAFERS) MODEL: T0081 SERIAL NO: T00812170073 100% NEW GOODS PRODUCED IN 2021_TJ # 0427 # & VN
TJ0427_880753351 # & ROBOTS SERVING THE ELECTRICAL INDUSTRY TU_T0081 (PARTS OF MACHINES PRODUCING SEMICONDUCTOR WAFERS) MODEL: T0081 SERIAL NO: T00812170073 100% NEW GOODS PRODUCED IN 2021_TJ # 0427 # & VN
24-April-2021
3818000000
SILICON WAFERS SHEET IS DOPED USED TO PRODUCE SOLAR CELLS DISC FORMAT: DIAMETER 200-300MM THICKNESS: 0.72MM 3PP NET: 1 571KG . 100% NEW. #&MY
SILICON WAFERS SHEET IS DOPED USED TO PRODUCE SOLAR CELLS DISC FORMAT: DIAMETER 200-300MM THICKNESS: 0.72MM 3PP NET: 1 571KG . 100% NEW. #&MY
03-January-2021
1905322000
EUROPEAN MARINE TYPE WAFERS 135G (SL 200 BARRELS NET TL 4.32 KG / BARREL TL GROSS 5KG / BARREL) # & VN
EUROPEAN MARINE TYPE WAFERS 135G (SL 200 BARRELS NET TL 4.32 KG / BARREL TL GROSS 5KG / BARREL) # & VN