SX806AXV0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SX806AXV0H01 WLP PROCESS 100% NEW TX 1 PART DH 37 TK 105629476260/E11#&KR
854290000000
SRG52AP40H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)) 200UM(+-)10UM THICK; SRG52AP40H01 WLP STAGE 100% NEW TX 1 PART DH 26 TK 105629476260/E11#&KR
854290000000
SWG42AGA0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM(+-)10UM SWG42AGA0001 CSP PROCESS 100% NEW TX 1 PART DH 11 TK 105623481350/E11#&KR
APOLLO TECH CO LTD
SOUTH KOREA
HS-Code
Products
854290000000
SEMICONDUCTOR SLICES FOR MAKING INTEGRATED CIRCUITS (MIRROR WAFER). SIZE: 12 INCHES THICKNESS: 0.65MM. XX KOREA NSX:APOLLO TECH 100% BRAND NEW RE-EXPORTED OUT OF ACCOUNT 105318246351/G12 ON 10/03/23 #&KR
854290000000
SEMICONDUCTOR SLICES FOR MAKING INTEGRATED CIRCUITS (MIRROR WAFER). SIZE: 12 INCHES THICKNESS : 0.65MM.XX KOREA NSX:APOLLO TECH 100% BRAND NEW. RE-EXPORTED A PART OF TK 105378432241/G12 ON 06/04/2023#&KR