SP 27 # & MATIT USED UNDER ELECTRONIC COMPONENTS HAS THE EFFECT OF THERMAL PAD 9.09 * 8.755 (1.5T) (TP: SILICON ALN AL2O3 CARBON) SIZE 9.09 * 8.755MM NEW GOODS 100 % #& CN
SP 27 # & MATIT USED UNDER ELECTRONIC COMPONENTS HAS THE EFFECT OF THERMAL PAD 9.09 * 8.755 (1.5T) (TP: SILICON ALN AL2O3 CARBON) SIZE 9.09 * 8.755MM NEW GOODS 100 % #& CN
15-July-2021
3214100000
SP07 # & MATIT USED UNDER ELECTRONIC COMPONENTS WITH THE EFFECT OF VERZON 28G AU OUT DOOR (43 * 43 1.5T) (TP: SILICON ALN AL2O3 CARBON FLEXIBLE PLATE) KT: 43 * 43MM 100% NEW GOODS # & CN
SP07 # & MATIT USED UNDER ELECTRONIC COMPONENTS WITH THE EFFECT OF VERZON 28G AU OUT DOOR (43 * 43 1.5T) (TP: SILICON ALN AL2O3 CARBON FLEXIBLE PLATE) KT: 43 * 43MM 100% NEW GOODS # & CN
22-October-2021
3214100000
300MML SILICONE (SILICON SEALANTS) # & VN
300MML SILICONE (SILICON SEALANTS) # & VN
17-September-2021
3214100000
SILICON HT906Z GLUE IS USED TO PASTE PLASTIC AND GLASS ITEMS IN THE FACTORY. 100% NEW GOODS # & VN
SILICON HT906Z GLUE IS USED TO PASTE PLASTIC AND GLASS ITEMS IN THE FACTORY. 100% NEW GOODS # & VN