PLATING CHEMICALS USED IN NICKEL PLATING INDUSTRY NEOZEN SPF-2K (INGREDIENTS: DI DI WATER 50-60% SODIUM HYPOPHOSPHITE 40-50% SODIUM MALATE <5% AMMONIUM HYDROXIDE <1%) (20L/CAN). LIQUID FORM 100% NEW PRODUCT
PLATING CHEMICALS USED IN NICKEL PLATING INDUSTRY NEOZEN SPF-2K (INGREDIENTS: DI DI WATER 50-60% SODIUM HYPOPHOSPHITE 40-50% SODIUM MALATE <5% AMMONIUM HYDROXIDE <1%) (20L/CAN). LIQUID FORM 100% NEW PRODUCT
16-October-2023
382499990000
MM02-00239F#&NIMUDEN CHEMICAL; NPR-4-B (CONTAINS SODIUM HYPOPHOSPHITE <32 %; AMMONIUM SUCCINATE <2%; AMMONIUM LACTATE <2%) USED FOR CIRCUIT BOARD MANUFACTURING
MM02-00239F#&NIMUDEN CHEMICAL; NPR-4-B (CONTAINS SODIUM HYPOPHOSPHITE <32 %; AMMONIUM SUCCINATE <2%; AMMONIUM LACTATE <2%) USED FOR CIRCUIT BOARD MANUFACTURING
21-November-2023
382499990000
EX-03-00161#&CHEMICAL PREPARATIONS USED IN NICKEL PLATING INDUSTRY ICP NICORON GIB-MY SODIUM HYPOPHOSPHITE13%+SODIUM LACTATE10%+AMMONIUM 7%+DISODIUM0.25%+SULFURIC ACID 9.75%(EX-03-00168)
EX-03-00161#&CHEMICAL PREPARATIONS USED IN NICKEL PLATING INDUSTRY ICP NICORON GIB-MY SODIUM HYPOPHOSPHITE13%+SODIUM LACTATE10%+AMMONIUM 7%+DISODIUM0.25%+SULFURIC ACID 9.75%(EX-03-00168)
13-November-2023
340290130000
NEOZEN SPF-MK GOLD PLATED CAVITY CLEANING AGENT (INGREDIENTS: WATER 70-80% SODIUM HYPOPHOSPHITE 10-20% SODIUM LACTATE 5-15% AMMONIUM HYDROXIDE <10% SULFURIC ACID 2%) (20L/CAN) LIQUID FORM 100% NEW
NEOZEN SPF-MK GOLD PLATED CAVITY CLEANING AGENT (INGREDIENTS: WATER 70-80% SODIUM HYPOPHOSPHITE 10-20% SODIUM LACTATE 5-15% AMMONIUM HYDROXIDE <10% SULFURIC ACID 2%) (20L/CAN) LIQUID FORM 100% NEW