METAL SURFACE CLEANING PRODUCT ANODIC RT-2 HAS THE MAIN INGREDIENTS ARE ORGANIC SULPHONATE COMPOUNDS ORGANIC ACIDS IN WATER WITH A LIQUID ACIDIC ENVIRONMENT (KQ NUMBER: 58/TB-KD6 DATED MARCH 5 2021) )
METAL SURFACE CLEANING PRODUCT ANODIC RT-2 HAS THE MAIN INGREDIENTS ARE ORGANIC SULPHONATE COMPOUNDS ORGANIC ACIDS IN WATER WITH A LIQUID ACIDIC ENVIRONMENT (KQ NUMBER: 58/TB-KD6 DATED MARCH 5 2021) )
SOLDER PASTE (PASTE FORM USED FOR SOLDERING MAIN INGREDIENTS ARE TIN: SN:84.5%; AG:3% CU:0.5% ROSIN:11.4%; GLUTARIC ACID:0.3%; ADIPIC ACID:0.3%) LFM 48W TM-HP(Y) 100% NEW. MANUFACTURER: LT MATERIALS CO. LTD.
SOLDER PASTE (PASTE FORM USED FOR SOLDERING MAIN INGREDIENTS ARE TIN: SN:84.5%; AG:3% CU:0.5% ROSIN:11.4%; GLUTARIC ACID:0.3%; ADIPIC ACID:0.3%) LFM 48W TM-HP(Y) 100% NEW. MANUFACTURER: LT MATERIALS CO. LTD.
22-September-2023
38101000000000
3008739.NVL#&CHEMICALS CHEM ITO ETCHANT IEF-L01-A 200L USED TO CLEAN SEMICONDUCTOR WAFERS (TP: IRON (III) CHLORIDE SOLUTION-CAS:7705-08-0;HYDROCHLORIC ACID-CAS:7647-01-0; WATER -CAS:7732-18-5).TT:200L/DRUM
3008739.NVL#&CHEMICALS CHEM ITO ETCHANT IEF-L01-A 200L USED TO CLEAN SEMICONDUCTOR WAFERS (TP: IRON (III) CHLORIDE SOLUTION-CAS:7705-08-0;HYDROCHLORIC ACID-CAS:7647-01-0; WATER -CAS:7732-18-5).TT:200L/DRUM