COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1 TO 1% AND 75-85% OF WATER USED IN ELECTRONICS INDUSTRY (20L / T)
COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1 TO 1% AND 75-85% OF WATER USED IN ELECTRONICS INDUSTRY (20L / T)