COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1 TO 1% AND 75-85% OF WATER USED IN ELECTRONICS INDUSTRY (20L / T)
COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1 TO 1% AND 75-85% OF WATER USED IN ELECTRONICS INDUSTRY (20L / T)
10-August-2021
382499000000
SOLDERON ACID HC (TOTAL 300 LITRES)
SOLDERON ACID HC (TOTAL 300 LITRES)
08-February-2021
382499990000
07030109 # & SOLUTION CREATED FOR MOTHERBOARD ROUGHNESS MEC V-BOND CB-7612H (SULFURIC ACID (H2SO4) 30-35%; CYCLOHEXYLAMINE (C6H13N) <5%) (22 KG / CAN)
07030109 # & SOLUTION CREATED FOR MOTHERBOARD ROUGHNESS MEC V-BOND CB-7612H (SULFURIC ACID (H2SO4) 30-35%; CYCLOHEXYLAMINE (C6H13N) <5%) (22 KG / CAN)
26-February-2021
382499990000
THE SOLUTION CREATED FOR MOTHERBOARD ROUGHNESS MEC V-BOND CB-7612H (SULFURIC ACID (H2SO4) 30-35%; CYCLOHEXYLAMINE (C6H13N) <5%) (22 KG / CAN) OF SECTION 3 RETURNS 103 221 875 300 / E11 25 / 03/2020
THE SOLUTION CREATED FOR MOTHERBOARD ROUGHNESS MEC V-BOND CB-7612H (SULFURIC ACID (H2SO4) 30-35%; CYCLOHEXYLAMINE (C6H13N) <5%) (22 KG / CAN) OF SECTION 3 RETURNS 103 221 875 300 / E11 25 / 03/2020