HS-Code
Products
3824999900
PREPARATIONS CONTAINING THE USE OF LIQUID SALT (20L / CAN) (20L / CAN) (INGREDIENTS: COBALT CHLORIDE AMMONIUM CHLORIDE CARBONIC AMMONIUM SALT SODIUM CHLORIDE). NEW GOODS100%. NUMBER180 / TB-KDHQ
3824999900
CHEMICAL COMPOSITION IS A MIXTURE OF POTASSIUM SALT AND LIQUID ADMIXTURE #B FREE BLACK NICKEL (HYDROXY AMMONIUM COBALT CHLORIDE AMMONIUM CHLORIDE POTASSIUM PYROPHOSPHATE) (20L / CAN) NEW 100% .SO: 2603 / TB-KD2
3824999900
PREPARATIONS CONTAINING THE USE OF LIQUID SALT (20L / CAN) (20L / CAN) (INGREDIENTS: COBALT CHLORIDE AMMONIUM CHLORIDE CARBONIC AMMONIUM SALT SODIUM CHLORIDE). NEW GOODS100%. NUMBER180 / TB-KDHQ
HS-Code
Products
3824999900
CP CONTAINS A MIXTURE OF LIQUID SALTS (FREE-NI BLACK#B)(20L/CAN)(TP: COBALT CHLORIDE 5% AMMONIUM CHLORIDE 5% CARBONIC ACID AMMONIUM SALT 88% SODIUM CHLORIDE 2%). 100% NEW PRODUCT. NO. 180/TB-KDHQ
3824999900
CP CONTAINS A MIXTURE OF LIQUID SALTS FREE-NI BLACK#B (20L/CAN)(TP: COBALT CHLORIDE 5% AMMONIUM CHLORIDE 5% CARBONIC ACID AMMONIUM SALT 88% SODIUM CHLORIDE 2%). 100% NEW PRODUCT. NO. 180/TB-KDHQ
3824999900
CHE.MICAL PREPARATIONS ARE A MIXTURE OF POTASSIUM SALTS AND LIQUID ADDITIVES FREE NICKEL BLACK #B (HYDROXY AMMONIUM COBALT CHLORIDE AMMONIUM CHLORIDE POTASSIUM PYROPHOSPHATE)(20L/CAN)100% NEW.NO.:2603/TB-KD2
HS-Code
Products
3824999900
0#&CHEMICAL ADDITIVES IN THE PLATING PROCESS CONTAINING: POTASSIUM FORMATE 2% WATER 78% CITRIC ACID MONOHYDRATE 19% COBALT ACETATE 1%. (KG-200 BALANCER) (SB030100018) 100% NEW
38249999
0#&CHEMICAL MJH H-CUPRUM A1(COPPER(II)SULFATE PENTAHYDRATE17+-5% SULFURIC ACID 3+-2% NICKEL SULFATE HEXAHYDRATE0.5+-0.4% COBALT(II)SULFATE HEPTAHYDRATE0.09+- 0.07%.20L/CAN.NEW100%
38249999
0#&CHEMICAL MJH H-CUPRUM A1(COPPER(II)SULFATE PENTAHYDRATE17+-5% SULFURIC ACID 3+-2% NICKEL SULFATE HEXAHYDRATE0.5+-0.4% COBALT(II)SULFATE HEPTAHYDRATE0.09+- 0.07%.20L/CAN.NEW100%
HS-Code
Products
3824999900
0 #& ADDITIVES IN THE PLATING STAGE CONTAINING: POTASSIUM FORMATE 2% CITRIC ACID MONOHYDRATE 19% 1%COBALT ACETATE. (KG-200 BALANCER) (SB030100018) 100% NEW
3824999900
0 #& CHEMICAL MJH H-CUPRUM A1 (COPPER (II) SULFATE PENTAHYDRATE17+-5% SULFURIC ACID 3+-2% NICKEL SULFATE HEXAHYDRATE0.5+-0.4% COBALT (II) SULFATE HEPTAHRATE0.09++ -0.07%.20L/CAN
3824999900
0 # & CHEMICAL MJH H-CUPRUM A1 (COPPER (II) SULFATE PENTAHYDRATE17 + -5% H2SO4 3 + -2% NICKEL SULFATE HEXAHYDRATE0.5 + -0.4% COBALT (II) SULFATE HEPTAHYDRATE 0.09 + -0.07 % .20L / CAN
HS-Code
Products
3824999900
ECO-ZW510 ORGANIC SUBSTANCES SOLUTION USED IN ELECTROPLATING AND COMPONENTS INCLUDE; CHROMIUM (III) 25% COBALT NITRATE 3% SODIUM FLUORIDE 10% 25KG / CAN 100% NEW
3824999900
SOLUTION OF ORGANIC SUBSTANCES MW-210 B IS AN ADDITIVE FOR ELECTROPLATING TP: SULFATE TIN: 4% COBALT SULFATE: 0.02% AMMONIUM ALUMINUM SULFATE DODECAHYDRATE: 3% 20KG / CAN ACCORDING TO KQPLP 571 / TB-K?6 (26.08.2020)
3824999900
ECO-ZW510 ORGANIC SUBSTANCES SOLUTION USED IN ELECTROPLATING AND COMPONENTS; CHROMIUM (III) 25% COBALT NITRATE 3% SODIUM FLUORIDE 10% 25KG / CAN 100% NEW
HS-Code
Products
382499990000
ORGANIC SUBSTANCES SOLUTION MW-210 B AN ADDITIVE FOR ELECTROPLATING TP: TIN SULFATE: 4% COBALT SULFATE: 0.02% AMMONIUM ALUMINUM SULFATE DODECAHYDRATE: 3% 20KG/CAN ACCORDING TO KQPTPL 571/ TB-KD6 (AUGUST 26 2020)
3824999900
SOLUTION OF ORGANIC SUBSTANCES MW-210 B AS AN ADDITIVE FOR ELECTROPLATING TP: TIN SULFATE: 4% COBALT SULFATE: 0.02% AMMONIUM ALUMINUM SULFATE DODECAHYDRATE: 3% 20KG/CAN ACCORDING TO KQPTPL 571/ TB-KD6 (AUGUST 26 2020)
3824999900
ZW 510 ORGANIC SUBSTANCES SOLUTION USED IN ELECTROPLATING PROCESS INGREDIENTS INCLUDE; CHROMIUM (III) 25% COBALT NITRATE 3% SODIUM FLUORIDE 10% 25KG/CAN. NEW 100%
HS-Code
Products
3824999900
NL32 # & ACTIVE PREPARATIONS FOR METAL SURFACES KINDS-IZB-256AY (MAIN INGREDIENTS INCLUDE SALT MIXTURES OF CHROMIUM AND COBALT IN AN ACID ENVIRONMENT SOLID CONTENT 24.9% -ALERT NUMBER 796 / TB-PTPL DATED 04.27.2016)
3824999900
CHEMICAL PREPARATIONS USED IN PLATING MAIN INGREDIENTS INCLUDE ZINC SALT COBALT CHROMIUM SALT OF PHOSPHATE IN ACIDIC ENVIRONMENT SOLID CONTENT 30.9% - ZTB-118 (CAS:7732-18-5 7789-04- 0.1314-13-2;NSX:DIPSOL)
3824999900
CHEMICAL PREPARATION USED IN PLATING INDUSTRY MAIN INGREDIENTS INCLUDE A MIXTURE OF CHROMIUM SALTS AND COBALT SALTS IN AN ACIDIC ENVIRONMENT SOLID CONTENT 24.9% - IZB-256 AY(CAS:1308-38-9 1308 -04-9;MANUFACTURER:DIPSOL)
HS-Code
Products
3824999900
EX-03-00163#&ICP NICORON GIB-1: CHEMICAL PREPARATION USED IN NICKEL PLATING INDUSTRY BORIC ACID 0.25% + NICKEL SULFATE 30-40% + COBALT SULFATE 0.1-10%+LACTIC ACID <10%+WATER 50 -60 (EX-03-00163)
3824999900
EX-03-00163#&ICP NICORON GIB-1: CHEMICAL PREPARATION USED IN NICKEL PLATING INDUSTRY BORIC ACID 0.25%+NICKEL SULFATE 30-40%+COBALT SULFATE 0.1-10%+LACTIC ACID <10%+ WATER 50 -60% (EX-03-00163)
3824999900
EX-03-00163#&CHEMICAL PREPARATIONS USED IN NICKEL PLATING INDUSTRY ICP NICORON GIB-1Y BORIC ACID 0.25%+NICKEL SULFATE 30~40%+COBALT SULFATE 0.1~10%+LACTIC ACID <10% +WATER 50- 60%(EX-03-00167)
HS-Code
Products
3824999900
MM02-00239G#&NIMUDEN CHEMICAL; NPR-4-A (CONTAINS NICKEL(II) SULFATE <22% ; COBALT(II) SULFATE < 0.1%) CIRCUIT PRODUCTION LINE
3824999900
MM02-00239G#&NIMUDEN CHEMICAL; NPR-4-A (CONTAINS NICKEL(II) SULFATE <22% ; COBALT(II) SULFATE < 0.1%) USED IN CIRCUIT BOARD MANUFACTURING
3824999900
MM02-00239G#&NIMUDEN CHEMICAL; NPR-4-A (CONTAINS NICKEL(II) SULFATE <22% ; COBALT(II) SULFATE < 0.1%) USED IN CIRCUIT BOARD MANUFACTURING
HS-Code
Products
3824999900
B1110086 # & POWDER: HOLE PASTE. CITY COBALT NICKEL OXIDE 5-10% (CAS 12737-30-3) ALUMINUM OXIDE 15-20% (CAS 1344-28-1) LANTHANUM OXIDE <5% (CAS 1312-81-8). NEW 100%
3824999900
B1110086 # & POWDER: HOLE PASTE. CITY COBALT NICKEL OXIDE 5-10% (CAS 12737-30-3) ALUMINUM OXIDE 15-20% (CAS 1344-28-1) LANTHANUM OXIDE <5% (CAS 1312-81-8). NEW 100%
3824999900
B1110086 # & POWDER: HOLE PASTE. CITY COBALT NICKEL OXIDE 5-10% (CAS 12737-30-3) ALUMINUM OXIDE 15-20% (CAS 1344-28-1) LANTHANUM OXIDE <5% (CAS 1312-81-8). NEW 100%
We have given over thousands of our clients a reason to be happy with the business results they have gained by using TTV.