HS-Code
Products
8534003000
3009-5025M00 # & MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SM-T736B LCD CTC / GSLPEDP0047 / 3009-5025M00_F. 100% NEW GOODS # & VN
8534003000
3009-5025M00 # & MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SM-T736B LCD CTC / GSLPEDP0047 / 3009-5025M00_F. 100% NEW GOODS # & VN
8534003000
3009-5025M00 # & MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SM-T736B LCD CTC / GSLPEDP0047 / 3009-5025M00_F. 100% NEW GOODS # & VN
HS-Code
Products
8534003000
3009-5017M00 # & SOFT PRINTED PRINTED CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SM-A102J B TO B PBA / UNEPEDP0036 / 3009-5017M00_F. 100% NEW GOODS # & VN
8534003000
3009-5025M11 # & MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SM-T736B LCD CTC / MIKPEDP0008 / 3009-5025M11_F. 100% NEW GOODS # & VN
8534003000
3009-5025M10 # & MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SM-T736B LCD CTC / MIKPEDP0008 / 3009-5025M10_F. 100% NEW GOODS # & VN
HS-Code
Products
8534002000
IC SIDE PLATE NOT MOUNTED COMPONENTS TWO SIDES OF THE CELLPHONE-MCDIV CONVERT FROM TKN 103 893 475 230 / E31 (15/03/2021) # & VN
8534002000
EAX69414501 # & PLATES UNMOUNTED IC COMPONENTS TWO SIDES OF CELLPHONE-MCDIV.NEW 100% (EAX69414501) RE-EXPORT OF GOODS FROM THE 11 AND 12 LINES OF TKNK 10 410 459 921 / A42 # & VN
8534002000
EAX69485701 # & PLATES UNMOUNTED IC COMPONENTS TWO SIDES OF CELLPHONE-MCDIV (EAX69485701). 100% NEW RE-EXPORT FROM TKNK 10 358 808 656 / E31 # & KR
HS-Code
Products
8534009000
XIAOMI CELLPHONE COMPONENTS: EXTRA BO MODEL: REDMI4X P / N: 58A136160005 NEW GOODS # & VN
8534009000
XIAOMI CELLPHONE COMPONENTS: MAIN BOARD MODEL: E7S P / N: 58E7S08A0003 NEW GOODS # & VN
8534009000
XIAOMI CELLPHONE COMPONENTS: EXTRA BO MODEL: REDMI5A P / N: 5600300100B6 NEW ROW # & VN
HS-Code
Products
8534009000
XIAOMI CELLPHONE COMPONENTS: MAIN MOTHERBOARDS MODEL: REDMI 10 P / N: 581K19AACCG00 OLD GOODS # & VN
8534009000
XIAOMI CELLPHONE COMPONENTS: MAIN MOTHERBOARDS MODEL: MI NOTE 10 LITE P / N: 5830F4LC0000 OLD GOODS # & VN
8534009000
XIAOMI CELLPHONE COMPONENTS: MAIN MOTHERBOARDS MODEL: POCO X3 PRO OLD GOODS # & VN
HS-Code
Products
8534009000
H580037-C0 # & THE PRINTED CIRCUIT (PAST THE PRODUCTION STAGE: PASTE MATERIAL STIFFENING HOT PRESSING DRYING STAMP PRINTING PRODUCTS KT COMMUNICATION CIRCUITS STAMPING CUTTING PRODUCTS) FOR CELLPHONES MH5 [BARE] / PHOENIX (47-6042217)) REV C0 # & VN
8534009000
H580037-C1 # & THE PRINTED CIRCUIT (PAST THE PRODUCTION STAGE: PASTE MATERIAL STIFFENING HOT PRESSING DRYING STAMP PRINTING PRODUCTS KT COMMUNICATION CIRCUITS STAMPING CUTTING PRODUCTS) FOR CELLPHONES MH5 [BARE] / PHOENIX (47-6042217)) REV C1 # & VN
8534009000
H580037D001 # & THE PRINTED CIRCUIT (PAST THE PRODUCTION STAGE: PASTE MATERIAL STIFFENING HOT PRESSING DRYING STAMP PRINTING PRODUCTS KT COMMUNICATION CIRCUITS STAMPING CUTTING PRODUCTS) FOR CELLPHONES MH5 [BARE] / PHOENIX ( 47-6041993) REV D0 # & VN
HS-Code
Products
8534009000
MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SIFPEDP0289 _SM-N986U SUB PBA (SK) R0.7 # & VN
8534009000
MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SIFPEDP0289 _SM-N986U SUB PBA (SK) R0.7 # & VN
8534009000
MULTI-LAYER SOFT PRINT CIRCUITS HAVE NOT ATTACHED COMPONENTS USED IN CELLPHONE PRODUCTION SIFPEDP0289 _SM-N986U SUB PBA (SK) R0.7. 100% NEW GOODS # & VN
HS-Code
Products
8534001000
CIRCUIT AN UNFINISHED SURFACE FOR MACHINE ASSEMBLY CELLPHONE CAMERA LENS DRIVING TEST SOCKET BOARD_SO2692 (100%) FLOW 1 TK: 103 884 978 630 / A12 DATED 03.10.2021 # & KR
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