CHIP MACHINES USED IN PRODUCTION OF SEMICONDUCTOR WAFERS DIE BONDER MODEL SD 2100 PLUS SERIES 9501804005289 AC 120V-240V 50-60HZ 1000VA COMPANY BESI SX SX YEAR: 2016 USED GOODS
CHIP MACHINES USED IN PRODUCTION OF SEMICONDUCTOR WAFERS DIE BONDER MODEL SD 2100 PLUS SERIES 9501804005289 AC 120V-240V 50-60HZ 1000VA COMPANY BESI SX SX YEAR: 2016 USED GOODS
17-February-2022
854150000000
WAFERS
WAFERS
21-April-2023
381800900000
HMT7742.4 WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS)ANNEXURE-III SL NO.027
HMT7742.4 WAFER (IC CHIPS IN THE FORM OF SILICON WAFERS)ANNEXURE-III SL NO.027