CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
18-December-2023
38180010
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
18-December-2023
38180010
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
19-December-2023
38180010
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS
CHEMICAL ELEMENTS AND COMPOUNDS DOPED FOR USE IN ELECTRONICS IN THE FORM OF DISCS WAFERS CYLINDERS RODS OR SIMILAR FORMS OR CUT INTO DISCS WAFERS OR SIMILAR FORMS WHETHER OR NOT POLISHED OR WITH A UNIFORM EPITAXIAL COATING (EXCL. ELEMENTS THAT HAVE BEEN FURTHER PROCESSED E.G. BY SELECTIVE DIFFUSION) : CHEMICAL ELEMENTS