SILICON WAFERS PLATE DOPED PRODUCTION USING SOLAR BATTERIES CTHH: SI CODE CAS: 7440-21-3 DISC DIAMETER (8-12 INCHES) X THICKNESS (0.65-0.75 MM) . NEW 100% # & VN
SILICON WAFERS PLATE DOPED PRODUCTION USING SOLAR BATTERIES CTHH: SI CODE CAS: 7440-21-3 DISC DIAMETER (8-12 INCHES) X THICKNESS (0.65-0.75 MM) . NEW 100% # & VN