HS-Code
Products
853340000000
VARIABLE RESISTORS USED ELECTRONIC CIRCUIT BOARD MANUFACTURING METAL OXIDE FILM RESISTER-J MORS 2W 300K HR0101-0005A 2003-002406. NEW 100%
853340000000
NL19 # & TRANSFORM RESISTOR USED ELECTRONIC CIRCUIT BOARD RESISTER-METAL OXIDE (S) MORS 2W RT-J 12K HR0101-0532A 2003-001093. 100% NEW GOODS
853340000000
NL19 # & TRANSFORM RESISTOR USED ELECTRONIC CIRCUIT BOARD RESISTER-METAL OXIDE (S) MORS 2W RT-J 12K HR0101-0532A 2003-001093. NEW 100%
HS-Code
Products
350610000000
0201-M00144#&GLUE (AF-8700SC) IS USED TO ATTACH COMPONENTS TO ELECTRONIC CIRCUIT BOARDS.(T/P: EPOXY RESIN AMINES AND THIOLS IRON OXIDE). NEW 100%
350610000000
0201-M00144#&GLUE (AF-8700SC) IS USED TO ATTACH COMPONENTS TO ELECTRONIC CIRCUIT BOARDS.(T/P: EPOXY RESIN AMINES AND THIOLS IRON OXIDE). NEW 100%
35061000000000
0201-M00144#&ADHESIVE (AF-8700SC) USED TO ATTACH COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. (T/P: EPOXY RESIN AMINES AND THIOLS IRON OXIDE). NEW 100%
HS-Code
Products
282550000000
FBC.002#&COPPER OXIDE USED IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS (SS-CUO) (SB010200001)
282550000000
FBC002#&COPPER OXIDE USED IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS (SS-CUO(DRUM)) (SB010200002)
281820000000
0 #&SMOOTHING POWDER FOR INSPECTION OF PRINTED CIRCUIT BOARDS CONTAINING: ALUMINUM OXIDE 98% ORGANIC ADDITIVE 2% 1.15KG/ 1UNA. (1.0MICROMET ALUMINA POWDER) (CG020100002)
HS-Code
Products
853310900000
MREMO-0218RA-DI/ ELECTRONIC BOARD-MOUNTED RESISTOR/ RSD01R0200KJ/ METAL OXIDE 1W 200KM J R-FORMING (1/ 2W SIZE). 100% NEW.
350699000000
MZCSN-0007NA-DI # & GLUE FOR FIXING COMPONENTS ON THE CIRCUIT BOARD / DX-920 (LT). TP: ALUMINUM OXIDE (1344-28-1); ALUMINUM HYDROXIDE; DIMETHYL (POLYSILOXANE) NEW 100%
350699000000
MZCSN-0007NA-DI # & ADHESIVES USED TO FIX COMPONENTS ON ELECTRONIC CIRCUIT BOARDS / DX-920 (LT). CITY: ALUMINIUM OXIDE (1344-28-1); ALUMINUM HYDROXIDE; DIMETHYL (POLYSILOXANE) 100% NEW
HS-Code
Products
381090000000
G25V200005#&SP6900 CIRCUIT BOARD SOLDER FLUX USED TO REMOVE OXIDE ON SOLDER SURFACE POLYGLYCOL ETHER 40-50% TRIETHYLENE GLYCOL DIAMINE 20-30% ... EVERTECH MANUFACTURER 100% BRAND NEW
381090000000
G25.V200005#&SP6900 CIRCUIT BOARD FLUX USED TO REMOVE OXIDE ON SOLDER SURFACE POLYGLYCOL ETHER 40-50% TRIETHYLENE GLYCOL DIAMINE 20-30% 100% BRAND NEW
381090000000
G25V200005#&CIRCUIT BOARD SOLDER FLUX SP6900 USED TO REMOVE OXIDE ON SOLDER SURFACE POLYGLYCOL ETHER 40-50% TRIETHYLENE GLYCOL DIAMINE 20-30% 100% NEW PRODUCT
HS-Code
Products
281122100000
NL25 # & SILICA POWDER FINENESS 200 COMPONENTS INCLUDE CRYSTALLINE SILICA ALUMINUM OXIDE AND IRON OXIDE USED TO PREVENT STATIC ELECTRICITY FOR CIRCUIT BOARDS
281122100000
NL2.5# & SILICA POWDER FINENESS 200 COMPONENTS INCLUDING CRYSTALLINE SILICA ALUMINUM OXIDE AND IRON OXIDE USED TO PREVENT STATIC ELECTRICITY FOR CIRCUIT BOARDS 100% NEW
281122100000
NL25 # & SILICA POWDER FINENESS 200 COMPONENTS INCLUDE CRYSTALLINE SILICA ALUMINUM OXIDE AND IRON OXIDE USED TO PREVENT STATIC ELECTRICITY FOR CIRCUIT BOARDS
HS-Code
Products
281810000000
POLISHING PRODUCT 0.3UM WITH INGREDIENTS PROPYLENE GLYCOL 20-30% ALUMINUM OXIDE 60-80% DISPERSED IN WATER LIQUID FORM USED IN ELECTRONIC CIRCUIT BOARDS 500ML/BOTTLE 100% BRAND NEW
340590900000
POLISHING PRODUCT 1.0UM WITH INGREDIENTS PROPYLENE GLYCOL 20-30% ALUMINUM OXIDE 60-80% DISPERSED IN WATER LIQUID FORM USED IN ELECTRONIC CIRCUIT BOARDS 500ML/BOTTLE 100% BRAND NEW
34059090000000
1.0UM POLISHING PRODUCT WITH INGREDIENTS PROPYLENE GLYCOL 20-30% ALUMINUM OXIDE 60-80% DISPERSED IN WATER LIQUID FORM USED IN ELECTRONIC CIRCUIT BOARDS 500ML/BOTTLE 100% NEW PRODUCT
HS-Code
Products
281820000000
ALUMINUM OXIDE POWDER USED TO CLEAN THE SURFACE OF PRINTED CIRCUIT BOARDS USED IN THE PRODUCTION OF SOFT PRINTED CIRCUIT BOARDS 100% BRAND NEW
32151990000000
IJR-4000-KD#&IJR-4000 FW200 INK IS USED TO PRINT SPECIFICATIONS ON PRINTED CIRCUIT BOARDS (TIANIUM DIOXIDE DIPHENYL(2 4 6-TRIMETHYLBENZOYL)PHOSPHINE OXIDE 1-METHOXY-2-PROPYL ACETATE ACRYLIC MONOMERS .)(1 BOTTLE=1KG)
321519900000
IJR-4000-KD#&IJR-4000 FW200 INK IS USED TO PRINT SPECIFICATIONS ON PRINTED CIRCUIT BOARDS (TIANIUM DIOXIDE DIPHENYL(2 4 6-TRIMETHYLBENZOYL)PHOSPHINE OXIDE 1-METHOXY-2-PROPYL ACETATE ACRYLIC MONOMERS .)(1 BOTTLE=1KG)
HS-Code
Products
28255000000000
COPPER CHEMICAL COPPER OXIDE CUO CAS: 1317-38-0 (99.65%) USED IN THE PROCESSING OF PCB CIRCUIT BOARDS. NEW 100%
282550000000
COP.PER OXIDE CUO CHEMICAL CAS: 1317-38-0 (99.65%) USED IN THE PROCESS OF PROCESSING PCB BOARDS. NEW 100%
282550000000
COPPER CHEMICAL COPPER OXIDE CUO CAS: 1317-38-0 (99.65%) USED IN THE PROCESSING OF PCB CIRCUIT BOARDS. NEW 100%
HS-Code
Products
691490000000
CERAMIC INSULATION BOARD CONTAINING ALUMINUM OXIDE KT: 870X900X25MM USED FOR INSULATION BETWEEN INJECTION MOLD AND RUBBER PRESS RESISTANT TO 300 DEGREES CELSIUS 100% BRAND NEW
691490000000
CERAMIC INSULATION BOARD CONTAINING ALUMINUM OXIDE SIZE: 870X900X5MM USED FOR INSULATION BETWEEN MOLDS AND RUBBER PRESSES CAN WITHSTAND TEMPERATURES OF 300 DEGREES CELSIUS 100% NEW PRODUCT
691490000000
CERAMIC INSULATION BOARD CONTAINING ALUMINUM OXIDE SIZE: 630X650X20MM USED FOR INSULATION BETWEEN INJECTION MOLDS AND RUBBER PRESSES CAN WITHSTAND TEMPERATURES OF 300 DEGREES CELSIUS 100% NEW PRODUCT
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