COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1 TO 1% AND 75-85% OF WATER USED IN ELECTRONICS INDUSTRY (20L / T)
COPPER GLEAM SOLUTION (TM) HS-200B-1 (J) USED IN PLATING CONTAINING 0.1-1% COPPER SULPHATE OXYALKYLENE POLYMER 15-25% SULFURIC ACID 0.1 TO 1% AND 75-85% OF WATER USED IN ELECTRONICS INDUSTRY (20L / T)
F300-0710 # & ADDITIVES TRN-988S1: PASSIVE USE COLOR (NOT POWDER COATED WITH STEARIC ACID CARBONATE WHICH IS PRODUCED FROM ROCKS OF HEADING 25.15 LESS THAN 1 MM PARTICLE SIZE) # & JP
F300-0710 # & ADDITIVES TRN-988S1: PASSIVE USE COLOR (NOT POWDER COATED WITH STEARIC ACID CARBONATE WHICH IS PRODUCED FROM ROCKS OF HEADING 25.15 LESS THAN 1 MM PARTICLE SIZE) # & JP
07-August-2023
382499990000
07020329#&COPPER GLEAM (TM) SOLUTION HS-200B-1 (J) USED IN PLATING CONTAINS COPPER SULPHATE0.1-1% OXYALKYLENE POLYMER15-25% SULFURIC ACID 0.1-1% AND WATER75-85% USED IN ELECTRONICS INDUSTRY-20L/T
07020329#&COPPER GLEAM (TM) SOLUTION HS-200B-1 (J) USED IN PLATING CONTAINS COPPER SULPHATE0.1-1% OXYALKYLENE POLYMER15-25% SULFURIC ACID 0.1-1% AND WATER75-85% USED IN ELECTRONICS INDUSTRY-20L/T
25-September-2023
38249999000000
CUSO4 CLEANING SOLUTION STUCK ON THE PRODUCT SURFACE AFTER COPPER PLATING COPPER GLEAM HVS-202B(J) (WATER 85-95%; POLYALKYLENE GLYCOL 5-15%; POLYMER 1-5%; SULFURIC ACID 0.1-1% ; COPPER SULFATE 0.1-1%) 100% NEW
CUSO4 CLEANING SOLUTION STUCK ON THE PRODUCT SURFACE AFTER COPPER PLATING COPPER GLEAM HVS-202B(J) (WATER 85-95%; POLYALKYLENE GLYCOL 5-15%; POLYMER 1-5%; SULFURIC ACID 0.1-1% ; COPPER SULFATE 0.1-1%) 100% NEW