HS-Code
Products
3824999900
ADDITIVE FOR PLATING ALLOYS (NI-P) ENF-M USED IN CN PLATING LIQUID 20L/ CAN; TP: SODIUM HYPOPHOSPHITE MONOHYDRATE 20-25% AMMONIUM HYDROXIDE SOLUTION 15-20% LACTIC ACID 10 -15% MALIC ACID 5-10% #&VN
3824999900
ADDITIVE FOR ALLOY PLATING(NI-P)ENF-M USED IN PLATING INDUSTRY LIQUID 20L/CAN;TP:SODIUM HYPOPHOSPHITE MONOHYDRATE 20-25% AMMONIUM HYDROXIDE SOLUTION 15-20% LACTIC ACID 10 -15% MALIC ACID 5-10% #&VN
3824999990
ADDITIVE FOR ALLOY PLATING(NI-P)ENF-M USED IN PLATING INDUSTRY LIQUID 20L/CAN;TP:SODIUM HYPOPHOSPHITE MONOHYDRATE 20-25% AMMONIUM HYDROXIDE SOLUTION 15-20% LACTIC ACID 10 -15% MALIC ACID 5-10%#&EN
HS-Code
Products
3824999990
CHEMICALS TOP NICORON TOM-SLF (20LTS) - BINDERS PREPARED INCLUDING SODIUM HYPOPHOSPHITE TP SUFATE NICKEL SODIUM MALATE LACTIC ACID AND WATER LIQUID (TKNK: 104 055 042 120 / A41 DATE 31/05/21) # & TH
3824999990
CHEMICAL ICP NICORON LPW-MLF (20LT)- MIXTURE OF PREPARATIONS USED IN PLATING MAIN INGREDIENT SODIUM HYPOPHOSPHITE#&JP
3824999990
CHEMICALS -ICP NICORON LPW-MLF (20LT)-PREPARATIONS FOR PLATING MAIN INGREDIENT SODIUM HYPOPHOSPHITE- ( CAS:7681-53-0-NAH2PO2) BRAND NEW 100%#&JP
HS-Code
Products
2835100000
LOPHOS-B ALLOY ADDITIVES USED IN PLATING INDUSTRY LIQUID FORM 25L/CAN INGREDIENTS: SODIUM HYPOPHOSPHITE <50% AMMONIUM HYDROXIDE <15% 100%NEW#& VN
2835100000
ADDITIVES FOR ELECTROLYTE NICKEL ENF-100B INGREDIENTS: SODIUM HYPOPHOSPHITE <50%; 20 LITERS/BARRELS#& VN
2835100000
ADDITIVES FOR ALLOY PLATING (NI-P) ENF-B USED IN INDUSTRIAL PLATING LIQUID FORM 20L / CAN; CITY: SODIUM HYPOPHOSPHITE MONOHYDRATE 45-55% AMMONIUM HYDROXIDE SOLUTION 1-2% LACTIC ACID 1-3% # & VN
HS-Code
Products
3824999990
CF 300B SOLUTION CONTAINING SODIUM HYPOPHOSPHITE 40 +/- 5% AMMONIUM CITRATE DIBASIC <2% SODIUM ACETATE TRIHYDRATE <2% PACKAGING 20L / CANS 167 / TB-KD1 (30/03/2020). NEW 100% # & KR
3824999990
CF 300B SOLUTION CONTAINING SODIUM HYPOPHOSPHITE 40 +/- 5% AMMONIUM CITRATE DIBASIC <2% SODIUM ACETATE TRIHYDRATE <2% PACKAGING 20L / CANS 167 / TB-KD1 (30/03/2020). NEW 100% # & KR
3824999990
CF 300B SOLUTION CONTAINING SODIUM HYPOPHOSPHITE 40 +/- 5% AMMONIUM CITRATE DIBASIC <2% SODIUM ACETATE TRIHYDRATE <2% PACKAGING 20L / CANS 167 / TB-KD1 (30/03/2020). NEW 100% # & KR
HS-Code
Products
3824999900
ELECTROSTATIC PLATING CHEMICAL NIMUDEN NPR-4-B HAS TP: SODIUM HYPOPHOSPHITE <32% (CAS: 7681-53-0 ) AMMONIUM SUCCINATE <2% (CAS: 15574-09-1 ) AMMONIUM LACTATE <2% ( CAS: 515-98-0 ) AND WATER (REMAINING).#&KR
3824999900
NIMUDEN NPR-4-B ELECTROSTATIC PLATING CHEMICAL HAS: SODIUM HYPOPHOSPHITE <32% (CAS: 7681-53-0) AMMONIUM SUCCINATE <2% (CAS: 15574-09-1) AMMONIUM LACTATE <2% (CAS: 515-98-0 ) AND WATER (REMAINING).#&KR
3824999900
NIMUDEN NPR-4-M ELECTROPLATED HC TP AMMONIUM LACTATE<15%(CAS 515-98-0); SODIUM HYPOPHOSPHITE<11%(CAS 7681-53-0); AMMONIUM SUCCINATE<10%(CAS 15574-09-1);SUCCINIC ACID<10%(CAS110-15-6) AND WATER#&KR
HS-Code
Products
3824999990
CHEMICAL NICORON TOM-SLF (20LTS) - MODULATED MOUNTING TP INCLUDES SODIUM HYPOPHOSPHITE NICKEL SUFATE SODIUM MALATE LACTICACID AND WATER USED IN PLATING (EXPORT 1 PORTION M20TK104536821800 / A41 17.2.22) # & TH
3824999990
CHEMICALS TOP NICORON TOM-2LF (20LTS) - PREPARATIONS USED IN PLATING TPS ARE SODIUM HYPOPHOSPHITE SODIUM LACTATC ACETIC DOMESTIC ACID (ITEM 17TK: 104478641300 / A41 ON 14.01.22) # & TH
3824999990
CHEMICAL ICP NICORON LPW-MLF (20LT)- PRODUCTS USED IN PLATING SODIUM HYPOPHOSPHITE'S MAIN INGREDIENT (EXPORT M2 103645579111/A41 09.11.20)#& JP
HS-Code
Products
3824999900
CF 300B SOLUTION CONTAINS SODIUM HYPOPHOSPHITE 40 +/- 5% AMMONIUM CITRATE DIBASIC < 2% SODIUM ACETATE TRIHYDRATE < 2% PACKING 20L/CAN 167/TB-KD1 (MARCH 30 2020). 100% NEW#&KRICE
3824999990
PEN 855B: ELECTROLYTIC NICKEL PLATING SOLUTION CONTAINS SODIUM HYPOPHOSPHITE 42 +/- 3% DL-MALIC ACID 7 +/- 3% THE REST IS WATER 20L/CAN PTPL NO. 758/TB-K?2 (09.07.2020 ). 100%NEW#& KR
3824999900
CF300M SOLUTION CONTAINS SODIUM HYPOPHOSPHITE 8 +/- 3%; 1 - (+) - LACTIC ACID 5 +/- 2% AMMONIUM CITRATE DIBASIC 5 +/- 2% SODIUM ACETATE TRIHYDRATE 3 +/- 1% USED IN PLATING INDUSTRY. NEW 100% #&KR
HS-Code
Products
3824999900
TOP NICORON SA 98 2LF (20LTS) CHEMICAL - CHEMICAL MIXTURE PREPARATIONS USED IN PLATING MAIN TP INCLUDE ACETIC ACID 2.4% SODIUM HYPOPHOSPHITE 42% CHELATING AGENT 13% AND WATER 42.6% #&TH
3824999990
CHEMICALS TOP NICORON SA 98 2LF (20LTS)-PRODUCTS USED IN PLATING THE MAIN CITY INCLUDES 2.4%ACETIC ACID SODIUM HYPOPHOSPHITE 42%CHELATING AGENT 13% WATER 42.6%#& TH
3824999990
TOP NICORON TOM -2LF CHEMICALS (20LTS) -PRODUCTS USED IN PLATING TP IS SODIUM HYPOPHOSPHITE SODIUM LACTATC ACETIC WATER IN WATER#& TH
HS-Code
Products
2835100000
SODIUM HYPOPHOSPHITE CHEMICALS (NAH2PO2.H2O) (CAS 10039-56-2) POWDER FORM USED IN ELECTROPLATING (25KG / BAG) 100% NEW GOODS # & CN
2835100000
CHEMICAL SODIUM HYPOPHOSPHITE NAH2PO2.H2O (CAS 10039-56-2) POWDER USED IN ELECTROPLATING (25KG/BAG) BRAND NEW 100%#&CN
2835100000
CHEMICAL SODIUM HYPOPHOSPHITE NAH2PO2.H2O (CAS 10039-56-2) POWDER FORM USED IN ELECTROPLATING (25KG/BAG) 100% BRAND NEW#&CN
HS-Code
Products
3824999900
CHEMICALS TOP NICORON TOM-2LF (20LTS) - INGREDIENTS: SODIUM HYPOPHOSPHITE DISODIUM SUCCINATE ACETIC WATER ACID USED IN PLATING (1 LITER = 1KG). 100% NEW GOODS. # & TH
3824999990
TOP CHEMICAL NICORON TOM-2LF (20LTS) - INGREDIENTS: SODIUM HYPOPHOSPHITE DISODIUM SUCCINATE ACETIC ACID IN WATER USED IN PLATING (1 LITER=1KG). 100% NEW PRODUCT.#&JP
3824999990
CHEMICAL TOP NICORON TOM-2LF (20LTS) - INGREDIENTS: SODIUM HYPOPHOSPHITE DISODIUM SUCCINATE ACETIC ACID IN WATER USED IN PLATING (1 LITER = 1 KG). 100% BRAND NEW.#&JP
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