998-PARTII#&NICKEL PLATING CHEMICALS NI 998 PART 2. MAIN INGREDIENTS SODIUM HYPOPHOSPHITE 50% (CAS CODE: 7681-53-0) WATER 45% (CAS CODE: 7732-18-5) AND LACTIC ACID 5% ( CAS CODE: 50-21-5)
998-PARTII#&NICKEL PLATING CHEMICALS NI 998 PART 2. MAIN INGREDIENTS SODIUM HYPOPHOSPHITE 50% (CAS CODE: 7681-53-0) WATER 45% (CAS CODE: 7732-18-5) AND LACTIC ACID 5% ( CAS CODE: 50-21-5)
SC-EN 1335C#&CHEMICAL FOR PLATING SYSTEM SC-EN 1335C (SODIUM HYPOPHOSPHITE) (NAPO2H2(H2O)) CAS CODE: 7681-53-0
SC-EN 1335C#&CHEMICAL FOR PLATING SYSTEM SC-EN 1335C (SODIUM HYPOPHOSPHITE) (NAPO2H2(H2O)) CAS CODE: 7681-53-0
28-September-2023
28351000000000
36-PARTII#&NI 36 NICKEL PLATING CHEMICAL PART 2. INGREDIENTS: SODIUM HYPOPHOSPHITE 50% (CAS CODE: 7681-53-0) LACTIC ACID 5% (CAS CODE: 50-21-5) WATER 45% ( CAS CODE: 7732-18-5)
36-PARTII#&NI 36 NICKEL PLATING CHEMICAL PART 2. INGREDIENTS: SODIUM HYPOPHOSPHITE 50% (CAS CODE: 7681-53-0) LACTIC ACID 5% (CAS CODE: 50-21-5) WATER 45% ( CAS CODE: 7732-18-5)
22-September-2023
28351000000000
SC111000ELPENCMIDP#&CHEMICAL C USED FOR NI 998 PLATING SYSTEM PART 2. MAIN INGREDIENTS SODIUM HYPOPHOSPHITE 50% (CAS CODE: 7681-53-0) WATER 45% (CAS CODE: 7732-18-5) AND LACTIC ACID 5 % (CAS CODE: 50-21-5)
SC111000ELPENCMIDP#&CHEMICAL C USED FOR NI 998 PLATING SYSTEM PART 2. MAIN INGREDIENTS SODIUM HYPOPHOSPHITE 50% (CAS CODE: 7681-53-0) WATER 45% (CAS CODE: 7732-18-5) AND LACTIC ACID 5 % (CAS CODE: 50-21-5)
11-August-2023
283510000000
36-MAKEUP#&NICKEL PLATING CHEMICALS NI 36 MAKE UP. INGREDIENTS: SODIUM HYPOPHOSPHITE 20% (CAS CODE: 7681-53-0) LACTIC ACID 5% (CAS CODE: 50-21-5) WATER 75% (CAS CODE: 7732-18-5)
36-MAKEUP#&NICKEL PLATING CHEMICALS NI 36 MAKE UP. INGREDIENTS: SODIUM HYPOPHOSPHITE 20% (CAS CODE: 7681-53-0) LACTIC ACID 5% (CAS CODE: 50-21-5) WATER 75% (CAS CODE: 7732-18-5)