HS-Code
Products
2835100000
YY-819B # & CHEMICALS FOR PLATING SYSTEMS YY-819B (SODIUM HYPOPHOSPHITE CAS: 7681-53-0) (NAPO2H2 (H2O)
2835100000
YY-819C#&COATING SYSTEM CHEMICALS YY-819C (SODIUM HYPOPHOSPHITE CAS: 7681-53-0)
2835100000
YY-819B#&CHEMICAL FOR PLATING SYSTEM YY-819B (SODIUM HYPOPHOSPHITE CAS: 7681-53-0)
HS-Code
Products
2835399000
PREPARATIONS USED IN PLATING FEB-1000 (25KG) MAIN INGREDIENTS SODIUM HYPOPHOSPHITE MONOHYDRATE 65% 25KG/BAG CAS 10039-56-2 NSX: AUROMEX 100%NEW
3824999900
SODIUM HYPOPHOSPHITE NICKEL SULFATE SODIUM MALATE LACTIC ACID AND WATER LIQUID FORM USED IN CN PLATED-TOP NICORON TOM-SLF (20LTS) (MARKET NO. 8659 / TB-TCHQ CAS: 7681-53-0-NAH2PO2H2 100% NEW
3824999900
LIQUID CHEMICAL PREPARATIONS WITH MAIN INGREDIENTS ARE SODIUM HYPOPHOSPHITE 2.5% ACETIC ACID AND TOP ADDITIVE NICORON SA 98 6LFD (20LTS) (CAS CODE: 7681-53-0- NAH2PO2 64-19-7) KQGD:1297- TB-KD 4 (SEPTEMBER 28 2017)
HS-Code
Products
38249999
CM-00111#&ICP NICORON FPF-2SV SOLVENT (AMMONIUM LACTATE: 12% SODIUM HYPOPHOSPHITE: 40% DEIONIZED WATER: 48%) FOR NICKEL PLATING LINE
3824999900
CM-00111#&ICP NICORON FPF-2SV SOLVENT (AMMONIUM LACTATE: 12% SODIUM HYPOPHOSPHITE: 40% DEIONIZED WATER: 48%) FOR NICKEL PLATING LINE
3824999900
CM-00111#&ICP NICORON FPF-2SV SOLVENT (AMMONIUM LACTATE: 12% SODIUM HYPOPHOSPHITE: 40% DEIONIZED WATER: 48%) FOR NICKEL PLATING LINE
HS-Code
Products
3824999900
CHEMICAL PREPARATIONS FOR THE PLATING INDUSTRY CONTAINING SODIUM HYPOPHOSPHITE SALT AND ADDITIVES SOLUBLE IN LIQUID ACIDIC WATER ENVIRONMENT SD-960B (20L/CAN). 100% NEW PRODUCT. NO. 229/TB-KD6
3824999900
CHEMICAL PREPARATIONS FOR PLATING INDUSTRY CONTAINING SODIUM HYPOPHOSPHITE SALT AND WATER-SOLUBLE ADDITIVES IN ACIDIC LIQUID MEDIUM SD-960B (20L/CAN). 100% BRAND NEW.NO. 229/TB-KD6
38249999
CHE.MICAL PREPARATIONS CONTAINING SODIUM HYPOPHOSPHITE AND ADDITIVES USED IN NICKEL PLATING SD-960M (20L/CAN) (INGREDIENT: SODIUM HYPOPHOSPHITE 25% ADDITIVE 5% WATER 70%). NEW 100%
HS-Code
Products
3824999900
.#&ADDITIVES FOR NICKEL ELECTROLYSIS ENF-100M;TP:SODIUM HYPOPHOSPHITE<25%;AMMONIUM HYDROXIDE<15%;LACTIC ACID<10%;MALIC ACID<5%;20 LITERS/BARREL#&VN
3824999900
.#&.ADDITIVES FOR NICKEL ELECTROLYSIS ENF-100M;TP:SODIUM HYPOPHOSPHITE<25%;AMMONIUM HYDROXIDE<15%;LACTIC ACID<10%;MALIC ACID<5%;20 LITERS/BARREL#&VN
2835100000
.#&.ADDITIVE FOR ELECTROLYSIS NICKEL ENF-100B INGREDIENTS: SODIUM HYPOPHOSPHITE <50%; 20 LITERS/CARTON#&VN
HS-Code
Products
2835299000
SVN28#&SUMER PLATING ADDITIVE SE-660-B NAH2PO2.H2O (SODIUM HYPOPHOSPHITE 45-49% ORGANIC ACID 7-10%) 100% NEW
2835299000
SVN28#&SUMER PLATING ADDITIVE SE-660-B NAH2PO2.H2O (SODIUM HYPOPHOSPHITE 45-49% ORGANIC ACID 7-10%) 100% NEW
2835299000
SVN28#&SUMER PLATING ADDITIVE SE-660-0 NAH2PO2.H2O (SODIUM HYPOPHOSPHITE 20-23% 7681-53-0 ORGANIC ACID 20-23%) 100% NEW
HS-Code
Products
28351000
NICKEL PLATING 100B (TRADE NAME: MID LT NICKEL 100 B 113551) COMPOSITION: SODIUM HYPOPHOSPHITE (NAPO2H2 15-25%) 100% NEW.
2835100000
NL09#&NICKEL PLATING 100B (TRADE NAME: MID LT NICKEL 100 B 113551) INGREDIENTS: SODIUM HYPOPHOSPHITE (NAPO2H2 15-25%) 100% NEW.
3824999900
NL11#&NICKEL PLATING 100 HPH (TRADE NAME: MID LT NICKEL 100HPH 113553) INGREDIENTS: SODIUM HYPOPHOSPHITE (NAPO2H2 30-35%) AND AMMONIUM HYDROXIDE (NH3 1-5%) 100% NEW
HS-Code
Products
2835100000
SODIUM HYPOPHOSPHITE SOLUTION USED IN NICKEL PLATING SD-960 (S) M (20L / CAN) (COMPONENT: SODIUM HYPOPHOSPHITE 25% 75% WATER). NEW 100%
3824999900
CHEMICAL PREPARATIONS CONTAIN SODIUM HYPOPHOSPHITE AND ADDITIVES USED IN NICKEL PLATING SD-960M (20L / CAN) (COMPONENT: SODIUM HYPOPHOSPHITE 25% 5% ADDITIVES 70% WATER). NEW 100%
3824999900
CHEMICAL PREPARATIONS CONTAIN SODIUM HYPOPHOSPHITE AND ADDITIVES USED IN NICKEL PLATING SD-960M (20L/CAN) (INGREDIENTS: 25%SODIUM HYPOPHOSPHITE 5%ADDITIVE 70%WATER). NEW 100%
HS-Code
Products
2835100000
07010118 # & CHEMICAL KG-531B CONTAINS SODIUM HYPOPHOSPHITE <60% (NAPO2H2) IS THE CHEMICAL USED IN NICKEL PLATING INDUSTRY (20L / CAN). 100% NEW
3824999900
07030205 # & NMUDEN NPR-8-B SOLUTION IS A CHEMICAL MIXTURE USED IN ELECTROPLATING WITH INGREDIENTS THAT ARE SODIUM HYPOPHOSPHITE (NAH2PO2.H2O) 46% AND WATER-20L / T. 100% NEW
3824999900
07030203 # & SOLUTION NIMUDEN NPR-8-M CONTAINS SODIUM HYPOPHOSPHITE 20% (NAPO2H2) 3% SODIUM HYDROXIDE 50% ORGANIC ACID IS MIXED ELECTROPLATING CHEMICALS (20L / DR). NEW 100%
HS-Code
Products
3824999900
CHEMICAL PREPARATION FOR NICKEL PLATING NI 37 PART II WHICH IS A MIXTURE OF SODIUM HYPOPHOSPHITE LACTIC ACID AND WATER. LIQUID PACKING 25L/CAN CAS:7681-53-0 50-21-5
3824999900
CHEMICAL PREPARATION USED IN THE NICKEL PLATING INDUSTRY NI 37 PART II IS A MIXTURE OF SODIUM HYPOPHOSPHITE LACTIC ACID AND WATER. LIQUID FORM PACKAGED 25L/CAN.CAS:7681-53-0 50-21-5 7732-18-5
38249999
CHEMICAL PREPARATION FOR NICKEL PLATING NI 36 PART II WHICH IS A MIXTURE OF SODIUM HYPOPHOSPHITE LACTIC ACID AND WATER. LIQUID FORM PACKING 25L/CAN CAS:50-21-5 7681-53-0
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