OCHW00035#& SOLDER STRIPPER SOLUTION USED TO PEEL OFF THE SN PLATING LAYER WHEN THE PLATING IS DEFECTIVE TO RE -PLATED. INGREDIENTS: AMMONIUM BIFLUORIDE 34% HYDROGEN PEROXIDE 15% D. I. WATER 51%
OCHW00035#& SOLDER STRIPPER SOLUTION USED TO PEEL OFF THE SN PLATING LAYER WHEN THE PLATING IS DEFECTIVE TO RE -PLATED. INGREDIENTS: AMMONIUM BIFLUORIDE 34% HYDROGEN PEROXIDE 15% D. I. WATER 51%
OCHW00035 # & SOLDER STRIPPER SOLUTION TO PEEL OFF THE COATING SN PLATING FAILS TO RE-PLATED. INGREDIENTS: AMMONIUM BIFLUORIDE 34% 15% HYDROGEN PEROXIDE D. I. WATER 51%
OCHW00035 # & SOLDER STRIPPER SOLUTION TO PEEL OFF THE COATING SN PLATING FAILS TO RE-PLATED. INGREDIENTS: AMMONIUM BIFLUORIDE 34% 15% HYDROGEN PEROXIDE D. I. WATER 51%
08-June-2023
381090000000
OCHW00035#&SOLDER STRIPPER SOLUTION IS USED TO REMOVE THE SN COATING WHEN THE PLATING IS FAULTY FOR RE-PLATING. INGREDIENTS: AMMONIUM BIFLUORIDE 34% HYDROGEN PEROXIDE 15% DI WATER 51% 100% NEW
OCHW00035#&SOLDER STRIPPER SOLUTION IS USED TO REMOVE THE SN COATING WHEN THE PLATING IS FAULTY FOR RE-PLATING. INGREDIENTS: AMMONIUM BIFLUORIDE 34% HYDROGEN PEROXIDE 15% DI WATER 51% 100% NEW